TSMC had shipped its first batch of 20-nm products to customer, the Xilinx UltraScale All Programmable device, in November - a quarter earlier than originally scheduled - as reported by the Commercial Times on November 12. Unlike the 28-nm process technology that offers four different production processes, TSMC's 20-nm technology uses double patterning technology and provides only one SoC (System on Chip) process. With a 1.9-fold gate density, products made by 20-nm process are 15% faster than those of 28-nm process given the same degree of power consumption, or 30% more energy-efficient given the same computation speed, according to the report.